Sensor Assembly
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Electronics Solutions Manufacturer
Sensor Assembly
Unique Process Capabilities for Quality Sensor Solutions:
C-MAC is in a unique position to manufacture your sensor in an automated, high quality efficient way. Our capabilities of ceramic circuit printing, pcba, wire bonding, hermetic housing and custom process development are a perfect fit with many of today’s increasing needs for quality sensors.
We have extended experience with assembly of sensors for a wide variety of applications. Some examples : Pressure sensors (Wheatstone bridge – piezo resistive – capacitive- MEMS), Mechanical compression (Wheatstone bridge), Image sensors, Proximity sensors, Fire detection (IR sensor), Gas sensors, Water level sensors, Fuel level sensors, Air flow sensors. Our certifications allow us to manufacture these for demanding markets like Automotive, Aerospace & Medical. Our engineering team helps to optimise your design for manufacturing.
Superior Quality
Process, Testing, Inspection, traceability according to IPC and all major market standards
All required Process Capabilities
Ceramic circuit, wire bonding, component assembly, hermetic housing and custom process development
Design for Manufacturing
Our engineering and process teams have extended experience to optimise your design for manufacturing
Our solution engineers are here to help
Navigating challenges, delivering solutions
Frequently Asked Questions
What type of sensors can you manufacture?
We have experience with many types, eg : Pressure, Image, Gas, Water level, Fuel level and Air flow sensors.
Do you have your own sensor products?
We focus on manufacturing sensors for third parties and don’t compete with our customers.
Why are ceramic materials ideal for sensors?
Stability of ceramic material under all environmental circumstances allow for stable and consistent measurements.
How to manufacture a pressure sensor with ceramics?
By printing a simple Wheatstone bridge on a small ceramic circuit you already have a basic pressure sensor.
What Inspection & Testing Capabilities are available?
We can provide 2D & 3D AOI, X-ray, Flying probe, ICT & functional testing.
Which Market Certifications does C-MAC have?
Automotive; IATF16949; Medical: ISO-13485; Aerospace: EN 9100.
Can you manage Chip on board?
We can accommodate gold, aluminium etc wire bonding, see specific section for detailed capabilities.
What Packaging Capabilities do you have?
We can provide Automated & Non-Automated T&R, Custom Trays etc.