Module Assembly
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Electronics Solutions Manufacturer
Module Assembly
Turnkey Solutions for Module Assembly:
C-MAC offers turnkey solutions for your module assembly requirements. Depending on the nature of the project, we can perform Glueing, Protective gel dispensing (under vacuum), Mechanical assembly, Interconnection (wire bonding), (laser) marking for traceability purposes & extensive Testing and measurements.
We also provide possibilities for hermetic modules & power modules: see our detailed sections regarding these. If volume requirements make automation an efficient option, we have the engineering and process skills to develop custom production lines together with our automation partners.
Turnkey Solutions
If you cannot find an existing process that matches your production needs, we provide you solutions.
Leading Process Capabilities
Wire & Die Bonding, Selective Soldering, State of the art SMT, Coating, vacuum soldering, hermetic sealing.
Supply Chain Management
Extensive supplier relations, Competitive & Reliable, Experience with VMI, KANBAN, JIT and flexible to adapt to specific customer needs.
Our solution engineers are here to help
Navigating challenges, delivering solutions.
Frequently Asked Questions
Can you provide coating options?
Yes, we have selective conformal coating available but also Globtop sealing.
What Inspection & testing capabilities are available?
We can provide 2D & 3D AOI, X-ray, Flying probe, ICT & functional testing.
Which Market Certifications does C-MAC have?
Automotive; IATF16949; Medical: ISO-13485; Aerospace: EN 9100.
Can you manage Chip on board?
We can accommodate gold, aluminium etc wire bonding, see specific section for detailed capabilities.
What Packaging Capabilities do you have?
We can provide Automated & Non-Automated T&R, Custom Trays etc.
Markets
Transportation & E-Mobility
Aerospace & Defence
Industrial & CleanTech
MedTech
Innovating the Future, Crafting your Electronic Solutions
Ronse, Belgium
Warwick, United Kingdom
Sherbrooke, Canada
Gdynia, Poland